#Reflow solder machine full

With a heating range up to maximum 400☌, the RF-250 can perform high-temperature soldering of over 300☌.

#Reflow solder machine full

Full operation can be carried out with high precision at stable temperature. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state.

The RF-250 can reflow solder boards measuring up to 150×150×5mm.ĥ heating zones in lower section and 1 heating zone in upper section all have digital display and PID control. The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. Integrated microprocessor for profile control and storage. As the board is directly heated by the hot plate, even boards requiring high heat capacity can be efficiently reflow soldered in a short time and with high temperature precision.ĥ zone heating plate makes reflow soldering of enamel or metal circuit boards easy. The Essemtec RO300 is a versatile reflow oven for low to mid volume soldering. The carrier-bar (or Teflon sheet carrier) presses the circuit board to be soldered directly on top of the hot plate and slides it along. Talk to us - we will find a suitable soldering system for you Contact us. 2 oz D108224 MTL Heatsink Copper Heatsink C071X229T250D00 Machine Shop Posted on. Sorry - there are no reflow soldering systems available at the moment. Using far-infrared and hot-air heating, it can reflow solder difficult boards requiring large heating capacity such as ceramic and enamel boards, as well as steel, aluminum, and other metal circuit boards. packages for high power RF require a precise solder reflow process. The time the solder is held above its melting point (time above liquidus) is important to ensure correct ‘wetting’ occurs between components and PCB.

Condensation reflow soldering system employs hermetically locked vacuum chamber and meets. Reflow This is the stage where the temperature within the reflow oven is increased above the melting point of the solder paste causing it to form a liquid. The RF-250 is a hot plate type of reflow soldering machine with a large heating capacity. Linear Stroke Module is suited for loading machine tools. Our Reflow Soldering Machine with the Highest Heat Capacity